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High thermal capacity device compatible soldering die bonder

High thermal capacity device compatible soldering die bonder

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement

  • Bonding Equipment

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